1. 中文

Yang Ronggui

Time:December 22, 2021 Editor:Tang Shiqing Source:


Professor


Email: ronggui@hust.edu.cn

Academic Area: heat and mass transfer

Academic Interests: thermal management; electronics cooling; phase change heat transfer; heat transfer enhancement; boiling; evaporation; liquid film boiling; spray cooling; bubble dynamics; micro/nano-structured surface; micro/nano-heat transfer; thermoelectrics; high power electronics; wide bandgap semiconductor; two-dimensional material; thermal radiation; solar utilization; building energy

 

Academic Degrees

PhD, 2006, Department of Mechanical Engineering, Massachusetts Institute of Technology (MIT), American;

Master, 2001, Department of Mechanical Engineering, University of California, Los Angeles (UCLA), American;

Master, 1999, Department of Engineering Thermophysics, Tsinghua University, Beijing, China;

Bachelor, 1996, School of Energy and Power Engineering, Xi’an Jiaotong University, Xi’ an, Shanxi, China.

 

Professional Experience

Professor (2020-present); School of Energy and Power Engineering, Huazhong University of Science and Technology;

Full Professor (2016-2019); Department of Mechanical Engineering, CU-Boulder;

Associate Professor (2011-2016); Department of Mechanical Engineering, CU-Boulder;

Assistant Professor (2006-2011); Department of Mechanical Engineering, CU-Boulder;

 

Selected Publications

1. Xiaokun Gu and Ronggui Yang, Phonon Transport and Thermal Conductivity in Layered Two-Dimensional Materials (Invited Review), Annual Review of Heat Transfer, Volume 19, pp. 1-65, 2016.

2. K. Koumoto, R. M. Tian, R. G. Yang, and C. L. Wan, “Chapter 18. Inorganic/Organic Hybrid Superlattice Materials”, Material Aspects of Thermoelectricity, edited by C. Uher, CRC Press, pp. 501-518, 2016.

3. Jose Ordonez-Miranda, Ronggui Yang, and Juan Jose Alvarado-Gil, “Thermal Conductivity of Particulate Composites,” Chapter 3 in “Nanoscale Thermoelectrics” in the Springer Series “Lecture Notes on Nanoscale Science and Technology”, edited by Zhimin Wang, Vol. 16, pp. 93-139, 2014.

4. Pilhwa Lee, Kurt Maute and Ronggui Yang, “An Extended Finite Element Method for the Analysis of Submicron Heat Transfer Phenomena,” book chapter in "Multiscale Methods in Computational Mechanics" in the Springer series “Lecture Notes in Applied and Computational Mechanics”, Vol. 55, pp. 195-212, 2011.

5. Suraj J. Thiagarajan, Wei Wang, and Ronggui Yang, “Nanocomposites as High Efficiency Thermoelectric Materials,” in Annual Review of Nano Research, Volume 3, edited by G.Z. Cao, Q.F. Zhang, and C.J. Brinker, World Scientific Publisher Co., Singapore, p. 447-492, 2009.

6. G. Chen, D. Borca-Tascuic and R.G. Yang, “Nanoscale Heat Transfer,” in “Encyclopedia of Nanoscience and Nanotechnology”, edited by H.S. Nalwa, Vol. 7, pp. 429-459, American Scientific Publishers, 2004.

 

Awards:

2020 Nukiyama Memorial Award in Thermal Science and Engineering, Heat Transfer Society of Japan

2017 Top 10 Physics Breakthrough, PhysicsWorld

2017 Invited Participants, Chinese-American Frontiers in Engineering (CAE & NAE)

2017 Outstanding Research Award, Department of Mechanical Engineering, CU-Boulder

2016 Invited Participants, Arab-American Frontiers in Science, Engineering, and Medicine (NAS & NAE)

2015 Fellow, American Society of Mechanical Engineering (ASME)

2014 Marquis Who’s Who in America (from 69th and subsequent editions).

2014 ITS Young Investigator Award, International Thermoelectric Society (ITS)

2013-2017 S.P. Chip and Lori Johnson Faculty Fellow of Engineering, CU-Boulder

2013 Outstanding Research Award, Department of Mechanical Engineering, CU-Boulder

2013 JSPS Invitation Fellow (Short Term), Japan Society for the Promotion of Science

2012 Provost's Faculty Achievement Award, Office of the Provost, CU-Boulder

2011 Steve Woodward Outstanding Faculty Award, Department of Mechanical Engineering, CU-Boulder

2010 ASME Bergles-Rohsenow Young Investigator Award in Heat Transfer

2010 Dean’s Award for the Outstanding Junior Faculty Member, CU-Boulder

2010 Biography featured as a technology developer with outstanding potential that could reverse the decline in the book “The Rise and Fall of American Technology” by Dr. Lynn G. Gref

2009 National Science Foundation (NSF) CAREER Award

2009 15th U.S. Frontiers of Engineering Symposium, National Academy of Engineering.

2008 Technology Review’s TR35 Award (one of the 35 young scientists and technologists in world who are under the age of 35, but their work--spanning medicine, computing, communications, electronics, nanotechnology, energy, and more--is changing our world.)

2008 DARPA Young Faculty Award (one of the 39 rising stars in university microsystems research)

2008-2012 Sanders Faculty Fellow, College of Engineering and Applied Science, CU-Boulder

2008 Outstanding Research Award, Department of Mechanical Engineering, CU-Boulder

2005 Best Paper Award – Research, InterPACK 2005, 1 out of 500+ papers

2005 Goldsmid Award, International Thermoelectrics Society

2004 NASA Certificate of Recognition for a Technical Innovation (Space Act Tech Brief Award), NASA

 

Project

1.       National Natural Science Foundation of China52036002, Fundamental Study on Heat Transfer Characteristics and Enhancement of Liquid Film Boiling and Spray Cooling Utilizing Gradient Micro-Porous Surface, 2021/01—2025/12.

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